Provided is a preparation method for an immunoelectrode. The immunoelectrode comprises a substrate, a gold layer, a conductive polymer layer and an antibody layer. The substrate, the gold layer, the conductive polymer layer and the antibody layer are sequentially attached from bottom to top. The preparation method for the immunoelectrode specifically comprises the following steps: (1) preparing the conductive polymer layer: preparing a polypyrrole layer on a gold-plated substrate to obtain a polypyrrole/gold-plated substrate; (2) preparing the immunoelectrode: preparing the antibody layer on the polypyrrole layer to obtain an antibody/polypyrrole/gold-plated substrate; and (3) forming an immunoelectrode system: fixing a bare gold-plated substrate to the outer side of the antibody/polypyrrole/gold-plated substrate to obtain the immunoelectrode system. A polypyrrole material is used for fixing an antibody of a biological recognition element and immobilizing the antibody on the immunoelectrode.