Invention Grant
- Patent Title: Photosensitive resin composition, laminate, and pattern forming process
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Application No.: US16728153Application Date: 2019-12-27
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Publication No.: US12055853B2Publication Date: 2024-08-06
- Inventor: Kumiko Hayashi , Michihiro Sugo
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee: Shin-Etsu Chemical Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: WHDA, LLP
- Priority: JP 18247071 2018.12.28
- Main IPC: G03F7/075
- IPC: G03F7/075 ; G03F7/16 ; G03F7/20 ; G03F7/30
Abstract:
A photosensitive resin composition comprising (A) a silicone skeleton-containing polymer, (B) a photoacid generator, and (C) a peroxide is coated to form a photosensitive resin coating which is unsusceptible to plastic deformation while maintaining flexibility. A pattern forming process using the composition is also provided.
Public/Granted literature
- US20200209751A1 PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, AND PATTERN FORMING PROCESS Public/Granted day:2020-07-02
Information query
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