Invention Grant
- Patent Title: Wafer repair method, apparatus and device, and storage medium
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Application No.: US17439030Application Date: 2021-06-11
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Publication No.: US12055912B2Publication Date: 2024-08-06
- Inventor: Yubin Lu
- Applicant: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Applicant Address: CN Hefei
- Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
- Current Assignee Address: CN Hefei
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: CN 2010839653.4 2020.08.19
- International Application: PCT/CN2021/099841 2021.06.11
- International Announcement: WO2022/037207A 2022.02.24
- Date entered country: 2021-09-14
- Main IPC: G05B19/18
- IPC: G05B19/18 ; G06F16/11

Abstract:
The present disclosure provides a wafer repair method, system, apparatus and device, and a storage medium, relating to the field of semiconductor devices. The method includes: a laser equipment acquires test data for repairing a predetermined wafer; the laser equipment sending the test data to a processing server so that the processing server converts the test data into repair data in a predetermined format; and the laser equipment obtaining the repair data in the predetermined format to repair the predetermined wafer.
Public/Granted literature
- US20230061095A1 WAFER REPAIR METHOD, APPARATUS AND DEVICE, AND STORAGE MEDIUM Public/Granted day:2023-03-02
Information query
IPC分类: