Invention Grant
- Patent Title: Multi-layer coil structure and inductor
-
Application No.: US17321636Application Date: 2021-05-17
-
Publication No.: US12057257B2Publication Date: 2024-08-06
- Inventor: Martin Kuo , Nanhai Zhu
- Applicant: ITG Electronics, Inc.
- Applicant Address: TW New Taipei
- Assignee: ITG ELECTRONICS, INC.
- Current Assignee: ITG ELECTRONICS, INC.
- Current Assignee Address: TW New Taipei
- Agency: Li & Cai Intellectual Property (USA) Office
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/24 ; H01F41/04

Abstract:
A multi-layer coil structure and an inductor are provided. The multi-layer coil structure includes a first coil body and a second coil body. The first coil body includes a first extension portion and a second extension portion extending in a first direction, and at least one third extension portion extending in a second direction. The second coil body includes a fourth extension portion, a fifth extension portion, and at least one sixth extension portion, the fourth extension portion and the fifth extension portion extend in the first direction, and the at least one sixth extension portion extend in the second direction. When the first coil body is detachably assembled with the second coil body, at least one first pin is formed by the first extension portion and the fourth extension portion, and at least one second pin is formed by the second extension portion and the fifth extension portion.
Public/Granted literature
- US20220367107A1 MULTI-LAYER COIL STRUCTURE AND INDUCTOR Public/Granted day:2022-11-17
Information query