Invention Grant
- Patent Title: Semiconductor structure manufacturing methods and semiconductor structures
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Application No.: US17616170Application Date: 2020-04-26
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Publication No.: US12057312B2Publication Date: 2024-08-06
- Inventor: Kai Cheng , Liyang Zhang
- Applicant: ENKRIS SEMICONDUCTOR, INC.
- Applicant Address: CN Jiangsu
- Assignee: ENKRIS SEMICONDUCTOR, INC.
- Current Assignee: ENKRIS SEMICONDUCTOR, INC.
- Current Assignee Address: CN Jiangsu
- Agency: The Small Patent Law Group, LLC
- Agent Christopher R. Carroll
- International Application: PCT/CN2020/087040 2020.04.26
- International Announcement: WO2021/217302A 2021.11.04
- Date entered country: 2021-12-02
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
The present invention provides a manufacturing method of a semiconductor structure and a semiconductor structure. The manufacturing method includes: providing a substrate; forming an amorphous layer on the substrate, wherein the amorphous layer includes a plurality of patterns to expose part of the substrate; forming a metal nitride layer on the amorphous layer; removing the amorphous layer to form a plurality of cavities between the substrate and the metal nitride layer; removing the substrate to form the semiconductor structure. In the present invention, an amorphous layer is formed on the substrate, and a metal nitride layer is formed on the amorphous layer. The amorphous layer can inhibit slip or dislocation during epitaxial growth, thereby improving the quality of the metal nitride layer and improving the performance of the semiconductor structure, while the metal nitride layer can realize self-supporting.
Public/Granted literature
- US20220246424A1 SEMICONDUCTOR STRUCTURE MANUFACTURING METHODS AND SEMICONDUCTOR STRUCTURES Public/Granted day:2022-08-04
Information query
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