- Patent Title: High density pick and sequential place transfer process and tool
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Application No.: US17345258Application Date: 2021-06-11
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Publication No.: US12057331B2Publication Date: 2024-08-06
- Inventor: Hyeun-Su Kim , Dariusz Golda , Chae Hyuck Ahn , Kevin T. Huang , Eric B. Newton
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Aikin & Gallant, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B65G47/90 ; H01L21/67 ; H01L25/075 ; H01L33/62 ; B41F16/00

Abstract:
Mass transfer tools and methods for high density transfer of arrays of micro devices are described. In an embodiment, a mass transfer tool includes a micro pick up array with an array of transfer heads arranged in clusters. The clusters of transfer heads can be used to pick up a high density group of micro devices followed by sequential placement onto a receiving substrate.
Public/Granted literature
- US20220013380A1 HIGH DENSITY PICK AND SEQUENTIAL PLACE TRANSFER PROCESS AND TOOL Public/Granted day:2022-01-13
Information query
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