Invention Grant
- Patent Title: Vacuum modulated two phase cooling loop efficiency and parallelism enhancement
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Application No.: US17030137Application Date: 2020-09-23
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Publication No.: US12057370B2Publication Date: 2024-08-06
- Inventor: Paul Diglio , Pooya Tadayon , David Shia
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt P.C.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; C23C16/00 ; H01L23/473

Abstract:
Embodiments disclosed herein include a temperature control system. In an embodiment, the temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a plurality of fluid lines between the pump and the spray chamber, where individual ones of the plurality of fluid lines are configured to provide the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a vacuum source fluidically coupled to the spray chamber, where the vacuum source controls a pressure within the spray chamber.
Public/Granted literature
- US20210351108A1 VACUUM MODULATED TWO PHASE COOLING LOOP EFFICIENCY AND PARALLELISM ENHANCEMENT Public/Granted day:2021-11-11
Information query
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