Invention Grant
- Patent Title: Semiconductor device with fuse component
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Application No.: US17508965Application Date: 2021-10-22
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Publication No.: US12057393B2Publication Date: 2024-08-06
- Inventor: Kai-Po Shang , Jui-Hsiu Jao
- Applicant: NANYA TECHNOLOGY CORPORATION
- Applicant Address: TW New Taipei
- Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee: NANYA TECHNOLOGY CORPORATION
- Current Assignee Address: TW New Taipei
- Agent Xuan Zhang
- Main IPC: H01L23/525
- IPC: H01L23/525 ; H01L27/06

Abstract:
A semiconductor device with a fuse component is provided. The semiconductor device includes a substrate having an active region; a fuse dielectric layer disposed in the active region; and a gate metal layer disposed in the active region and surrounded by the fuse dielectric layer. The gate metal layer is configured to receive a voltage to change a resistivity between the gate metal layer and the active region.
Public/Granted literature
- US20230130975A1 SEMICONDUCTOR DEVICE WITH FUSE COMPONENT Public/Granted day:2023-04-27
Information query
IPC分类: