Invention Grant
- Patent Title: Wire bonding apparatus
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Application No.: US18060012Application Date: 2022-11-30
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Publication No.: US12057428B2Publication Date: 2024-08-06
- Inventor: Jongeun Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. CHAU & ASSOCIATES, LLC
- Priority: KR 20200085207 2020.07.10
- Main IPC: B23K20/00
- IPC: B23K20/00 ; B23K3/06 ; H01L23/00 ; B23K101/40

Abstract:
A wire bonding includes a capillary that extrudes a wire; a wire clamp assembly disposed on the capillary; a support disposed on the wire clamp assembly; a wire contact member; and a slide rail that provides a slide hole. The wire clamp assembly includes: a first member; a second member spaced apart from the first member; a first contact member coupled to the first member; and a second contact member coupled to the second member and spaced apart from the first contact member. The first member includes a first body that extends in a first direction and a first tilting member that extends at an acute angle relative to the first direction. The second member includes a second body that extends in the first direction and is spaced apart from the first body in a second direction a second tilting member.
Public/Granted literature
- US20230086643A1 WIRE BONDING APPARATUS Public/Granted day:2023-03-23
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