- Patent Title: Array substrate, manufacturing method therefor and display panel
-
Application No.: US17418259Application Date: 2020-03-09
-
Publication No.: US12057452B2Publication Date: 2024-08-06
- Inventor: En-Tsung Cho , Fengyun Yang , Qionghua Mo , Yong Zhang
- Applicant: HKC CORPORATION LIMITED
- Applicant Address: CN Shenzhen
- Assignee: HKC CORPORATION LIMITED
- Current Assignee: HKC CORPORATION LIMITED
- Current Assignee Address: CN Shenzhen
- Priority: CN 1910197080.7 2019.03.15
- International Application: PCT/CN2020/078390 2020.03.09
- International Announcement: WO2020/187073A 2020.09.24
- Date entered country: 2021-06-25
- Main IPC: H01L27/12
- IPC: H01L27/12 ; G02F1/1362

Abstract:
The present application discloses an array substrate, a manufacturing method therefor and a display panel. The manufacturing method for the array substrate includes steps of: forming a base layer; forming a semiconductor layer on the base layer; forming a metal layer on the semiconductor layer, where the upper surface of the metal layer contains a first nitride or a first oxide; etching the metal layer into a source/drain electrode; and forming a passivation layer on the source/drain electrode, where the passivation layer is a second nitride structure corresponding to the first nitride or a second oxide structure corresponding to the first oxide.
Public/Granted literature
- US20220068976A1 ARRAY SUBSTRATE, MANUFACTURING METHOD THEREFOR AND DISPLAY PANEL Public/Granted day:2022-03-03
Information query
IPC分类: