Invention Grant
- Patent Title: Semiconductor device with inductor windings around a core above an encapsulated die
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Application No.: US17144121Application Date: 2021-01-07
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Publication No.: US12057468B2Publication Date: 2024-08-06
- Inventor: Chien-Hsien Kuo , Hon-Lin Huang , Han-Yi Lu , Ching-Wen Hsiao , Alexander Kalnitsky
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01F17/00
- IPC: H01F17/00 ; H01F17/04 ; H01F41/04 ; H01L49/02

Abstract:
An inductor includes a core and a conductive spiral wound around the core. The core includes a buffer layer, an etch stop layer, and a core material layer sequentially stacked. The core material layer includes a ferromagnetic material. A total area of a vertical projection of the core material layer is smaller than an area occupied by the etch stop layer. The vertical projection of the core material layer falls entirely on the etch stop layer. The etch stop layer horizontally protrudes with respect to the core material layer.
Public/Granted literature
- US20220216295A1 INDUCTOR, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-07-07
Information query
IPC分类:
H | 电学 |
H01 | 基本电气元件 |
H01F | 磁体;电感;变压器;磁性材料的选择 |
H01F17/00 | 信号类型的固定电感器 |