Invention Grant
- Patent Title: Electronic device
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Application No.: US17823338Application Date: 2022-08-30
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Publication No.: US12057666B2Publication Date: 2024-08-06
- Inventor: Takeshi Harada
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: WORKMAN NYDEGGER
- Main IPC: H01R24/62
- IPC: H01R24/62 ; G06F13/40 ; G06F3/12

Abstract:
There are provided a sheet metal; a substrate having a first surface facing an inner surface of the sheet metal; a first receptacle connector having a first part which is in contact with the first surface, and a second part facing the first part, and configured to be coupled to a first plug via a first opening of the sheet metal; and a first prevention section that is coupled to the sheet metal, presses the second part, and prevents the first receptacle connector from peeling off from the first surface.
Public/Granted literature
- US20230068782A1 ELECTRONIC DEVICE Public/Granted day:2023-03-02
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