Invention Grant
- Patent Title: Package structure and method of forming the same
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Application No.: US18446146Application Date: 2023-08-08
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Publication No.: US12058101B2Publication Date: 2024-08-06
- Inventor: Chen-Hua Yu , Chih-Hua Chen , Hao-Yi Tsai , Yu-Feng Chen
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- The original application number of the division: US17188707 2021.03.01
- Main IPC: H01L27/14
- IPC: H01L27/14 ; G06F15/16 ; G06F21/51 ; G06F21/56 ; H01L21/48 ; H01L21/768 ; H01L23/00 ; H01L23/13 ; H01L23/48 ; H01L23/538 ; H04L9/40 ; H04L61/10 ; H04L61/4511 ; H10N10/01 ; H01L21/56 ; H01L23/498 ; H04L101/604
Abstract:
Package structures and methods of forming package structures are described. A method includes placing a first package within a recess of a first substrate. The first package includes a first die. The method further includes attaching a first sensor to the first package and the first substrate. The first sensor is electrically coupled to the first package and the first substrate.
Public/Granted literature
- US20230386975A1 PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2023-11-30
Information query
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