Invention Grant
- Patent Title: Slicing and tiling for sub-image signaling in video coding
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Application No.: US18171619Application Date: 2023-02-20
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Publication No.: US12058383B2Publication Date: 2024-08-06
- Inventor: Ye-Kui Wang , FNU Hendry , Jianle Chen
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Agency: Conley Rose, P.C.
- Main IPC: H04N19/184
- IPC: H04N19/184 ; H04N19/119 ; H04N19/169 ; H04N19/174 ; H04N19/176 ; H04N19/46 ; H04N19/70 ; H04N19/96

Abstract:
A video coding mechanism is disclosed. The mechanism includes receiving a bitstream including a first slice of a coded image. The coded image is associated with a picture parameter set (PPS) in the bitstream. The first slice is associated with a slice header in the bitstream. A list of identifiers (IDs) is parsed from the PPS. A first ID is parsed from the slice header of the first slice. The first ID matches one of the IDs in the list of IDs in the PPS. A list of tiles coded in the first slice is determined based on the first ID. The first slice is determined to generate a reconstructed sub-image of the coded image.
Public/Granted literature
- US20230283809A1 Slicing And Tiling For Sub-Image Signaling In Video Coding Public/Granted day:2023-09-07
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