Invention Grant
- Patent Title: Hybrid modular wireless sensor
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Application No.: US18071020Application Date: 2022-11-29
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Publication No.: US12058481B2Publication Date: 2024-08-06
- Inventor: James B. Phillips , Don Recupido , Nathan Frost , Randy Scott Brown
- Applicant: Watlow Electric Manufacturing Company
- Applicant Address: US MO St. Louis
- Assignee: Watlow Electric Manufacturing Company
- Current Assignee: Watlow Electric Manufacturing Company
- Current Assignee Address: US MO St. Louis
- Agency: Burris Law, PLLC
- Main IPC: H04Q9/00
- IPC: H04Q9/00 ; G01D11/24 ; G01D21/00 ; H04L41/082

Abstract:
A wireless sensor assembly incudes a housing, a wireless power source, a wireless communication component, and firmware. The housing defines a first aperture for receiving an external sensor and a second aperture defining a communication port configured to receive a wire harness. The wireless communications component and the firmware are powered by the wireless power source. The wireless communications component is configured to be in electrical communication with the external sensor and transmit data from the external sensor to an external device. The firmware is configured to manage a rate of data transmittal from the wireless communications component to the external device. The wireless power source, the wireless communications component, and the firmware are mounted within the same housing. The data from the external sensor is transmitted from the external sensor wirelessly through the wireless communications component or through the wire harness to the external device for processing.
Public/Granted literature
- US20230088861A1 HYBRID MODULAR WIRELESS SENSOR Public/Granted day:2023-03-23
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