Invention Grant
- Patent Title: Cooling assembly and liquid cooling apparatus
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Application No.: US17832723Application Date: 2022-06-06
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Publication No.: US12058839B2Publication Date: 2024-08-06
- Inventor: Kai Chen , Yaoyin Fan , Mingqing Luo
- Applicant: Celestica Technology Consultancy (Shanghai) Co. Ltd
- Applicant Address: CN Shanghai
- Assignee: Celestica Technology Consultancy (Shanghai) Co. Ltd
- Current Assignee: Celestica Technology Consultancy (Shanghai) Co. Ltd
- Current Assignee Address: CN Shanghai
- Agency: IPRTOP LLC
- Priority: CN 2111600696.8 2021.12.24 CN 2123299728.3 2021.12.24
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
The present disclosure provides a liquid cooling assembly and a liquid cooling apparatus. The liquid cooling assembly includes: two heat conducting plates, configured to perform heat dissipation on a storage module attached to each of the heat conducting plates; a liquid cooling tube, disposed on an end of the each heat conducting plates and configured to perform liquid cooling on the heat conducting plates; and an elastic support, disposed between the two heat conducting plates and configured to apply elastic pressure to the heat conducting plates during attachment between the heat conducting plates and the storage modules, to cause the heat conducting plates to be tightly attached to surfaces of the storage modules, and cause the storage modules to be easily separated from the heat conducting plates after the elastic support is removed from the two heat conducting plates.
Public/Granted literature
- US20230209770A1 COOLING ASSEMBLY AND LIQUID COOLING APPARATUS Public/Granted day:2023-06-29
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