Invention Grant
- Patent Title: Memory device including a semiconducting metal oxide fin transistor and methods of forming the same
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Application No.: US17229753Application Date: 2021-04-13
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Publication No.: US12058873B2Publication Date: 2024-08-06
- Inventor: Yong-Jie Wu , Yen-Chung Ho , Hui-Hsien Wei , Chia-Jung Yu , Pin-Cheng Hsu , Mauricio Manfrini , Chung-Te Lin
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: The Marbury Law Group, PLLC
- Main IPC: H10B61/00
- IPC: H10B61/00 ; H01L21/02 ; H01L29/24 ; H01L29/417 ; H01L29/66 ; H01L29/78 ; H10B53/30 ; H10B63/00 ; H10N50/01 ; H10N70/00

Abstract:
A semiconductor device includes a semiconducting metal oxide fin located over a lower-level dielectric material layer, a gate dielectric layer located on a top surface and sidewalls of the semiconducting metal oxide fin, a gate electrode located on the gate dielectric layer and straddling the semiconducting metal oxide fin, an access-level dielectric material layer embedding the gate electrode and the semiconducting metal oxide fin, a memory cell embedded in a memory-level dielectric material layer and including a first electrode, a memory element, and a second electrode, and a bit line overlying the memory cell. The first electrode may be electrically connected to a drain region within the semiconducting metal oxide fin through a first electrically conductive path, and the second electrode is electrically connected to the bit line.
Public/Granted literature
- US20210408116A1 MEMORY DEVICE INCLUDING A SEMICONDUCTING METAL OXIDE FIN TRANSISTOR AND METHODS OF FORMING THE SAME Public/Granted day:2021-12-30
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