Invention Grant
- Patent Title: Shield optimization for maximizing heat dissipation at the device tissue interface and improving fixation
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Application No.: US16885363Application Date: 2020-05-28
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Publication No.: US12059558B2Publication Date: 2024-08-13
- Inventor: Michael D. Eggen , Yong K. Cho , D'anne E. Kudlik
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: Shumaker & Sieffert, P.A
- Main IPC: A61M60/876
- IPC: A61M60/876 ; A61M60/178 ; A61M60/232 ; A61M60/237 ; A61M60/422 ; A61M60/50 ; A61M60/873
Abstract:
A controller for an implantable medical device including a housing sized and configured to be received within a patient, the housing having a thermally conductive shell defining an exterior surface. At least a portion of the exterior surface of the thermally conductive shell defines at least one from the group consisting of a plurality of corrugations and a plurality of protuberances.
Information query
IPC分类:
