Provided is a hydrophilization treatment liquid for a semiconductor wafer surface, the hydrophilization treatment liquid being capable of imparting hydrophilicity to the semiconductor wafer surface.
A hydrophilization treatment liquid for a semiconductor wafer surface, the hydrophilization treatment liquid comprising water and a compound represented by Formula (1) below, and a total content of the water and the compound represented by Formula (1) below being 95 wt. % or greater.

R1O—(C3H6O2)n—H  (1)



where R1 denotes a hydrogen atom, a hydrocarbon group having from 1 to 24 carbon atoms and optionally having a hydroxyl group, or a group represented by R2CO, the R2 denoting a hydrocarbon group having from 1 to 24 carbon atoms; and n indicates an average degree of polymerization of a glycerin unit in the parentheses, and is from 2 to 60.