Invention Grant
- Patent Title: Heat transport device and method for manufacturing same
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Application No.: US17253576Application Date: 2018-06-27
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Publication No.: US12061053B2Publication Date: 2024-08-13
- Inventor: Yutaka Suzuki , Takashi Saito , Shingo Ikarashi
- Applicant: WELCON INC.
- Applicant Address: JP Niigata
- Assignee: WELCON INC.
- Current Assignee: WELCON INC.
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- International Application: PCT/JP2018/024383 2018.06.27
- International Announcement: WO2020/003411A 2020.01.02
- Date entered country: 2020-12-17
- Main IPC: F28D7/16
- IPC: F28D7/16

Abstract:
A heat transport device comprises first flow passages through which a first fluid flows, and second flow passages through which a second fluid flows, wherein a cross-section A satisfying the following Requirement 1 to Requirement 3 can be achieved. Requirement 1 is that the cross-section A is a cross-section perpendicular to the second flow passages. Requirement 2 is that the holes of the second flow passages are disposed so as to be aligned in the left-right direction and to form layers in the up-down direction; and when comparing layers with holes adjacent in the up-down direction, the holes of the second flow passages are not disposed at the same position in the left-right direction. Requirement 3 is that the first flow passages exist between the layers with holes adjacent in the up-down direction, and the first flow passages meander in the up-down direction so as to avoid the holes of the second flow passages in the layers with holes that are sandwiched in the up-down direction.
Public/Granted literature
- US20210270536A1 HEAT TRANSPORT DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2021-09-02
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