Invention Grant
- Patent Title: Temperature detecting element and imaging apparatus
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Application No.: US17278185Application Date: 2019-08-16
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Publication No.: US12061121B2Publication Date: 2024-08-13
- Inventor: Hajime Hosaka , Yoshikazu Nitta , Kenichi Okumura
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: CHIP LAW GROUP
- Priority: JP 18187273 2018.10.02
- International Application: PCT/JP2019/032139 2019.08.16
- International Announcement: WO2020/070985A 2020.04.09
- Date entered country: 2021-03-19
- Main IPC: G01J5/48
- IPC: G01J5/48 ; G01J5/00 ; H04N5/33
Abstract:
There is provided a temperature detecting element that includes a light-collecting portion and a sensor portion. The light collecting portion is constituted by a first light-collecting portion to which infrared light is incident and a second light-collecting portion to which infrared light having been exited from the first light-collecting portion is incident. The sensor portion is a portion to which infrared light having been exited from the second light-collecting portion is incident. At least one of the first light-collecting portion and the second light-collecting portion is provided on a base that covers the temperature detecting element.
Public/Granted literature
- US20210364360A1 TEMPERATURE DETECTING ELEMENT AND IMAGING APPARATUS Public/Granted day:2021-11-25
Information query
