Invention Grant
- Patent Title: Method for producing radiation-sensitive resin composition and pattern forming method
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Application No.: US17902202Application Date: 2022-09-02
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Publication No.: US12061415B2Publication Date: 2024-08-13
- Inventor: Takumi Tanaka , Takashi Bannai , Takamitsu Tomiga , Kohei Higashi , Fumihiro Yoshino , Yuma Kurumisawa
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP 20055609 2020.03.26
- Main IPC: G03F7/00
- IPC: G03F7/00 ; G03F7/028

Abstract:
A method for producing a composition, the method being for producing a composition using a stirring device provided with a stirring tank and a stirrer, includes a mixing step of charging a resin, an acid generator, and a solvent into the stirring tank, and a stirring step of stirring the mixture accommodated in the stirring tank, using the stirrer, in which a ratio c of a content of the acid generator to a total mass of the mixture is 0.3% to 2.5% by mass, the stirrer is provided with a rotatable stirring shaft, a plurality of support parts attached to the stirring shaft, and a plurality of stirring elements attached to each of end parts of the plurality of support parts, the shape and the arrangement of the stirring elements are specified, and the positions of the plurality of stirring elements are specified so as to satisfy a specific Expression (1).
Public/Granted literature
- US20230099422A1 METHOD FOR PRODUCING RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD Public/Granted day:2023-03-30
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