Invention Grant
- Patent Title: Coil component
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Application No.: US17103050Application Date: 2020-11-24
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Publication No.: US12062484B2Publication Date: 2024-08-13
- Inventor: Ju Hwan Yang , Seung Mo Lim , Tae Jun Choi , Byung Soo Kang , Boum Seock Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: MORGAN, LEWIS & BOCKIUS LLP
- Priority: KR 20200125667 2020.09.28
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F17/00 ; H01F17/04 ; H01F27/02 ; H01F27/29

Abstract:
A coil component includes a body having one surface, and one end surface and the other end surface connected to the one surface and opposing each other; a coil portion including lead-out patterns within the body; slit portions respectively disposed in an edge portion between the one end surface and the one surface of the body and an edge portion between the other end surface and the one surface of the body to expose the lead-out patterns; external electrodes disposed to be spaced apart from each other on the one surface and respectively extending to the slit portions to be connected to the lead-out patterns; and surface insulating layers, respectively disposed on the one end surface and the other end surface of the body. The surface insulating layers include a first insulating thin film including silicon dioxide (SiO2), and a second insulating thin film including aluminum oxide (Al2O3).
Public/Granted literature
- US20220102065A1 COIL COMPONENT Public/Granted day:2022-03-31
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