Invention Grant
- Patent Title: Heat dissipation from a balancing circuit for an ultracapacitor module
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Application No.: US16019639Application Date: 2018-06-27
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Publication No.: US12062489B2Publication Date: 2024-08-13
- Inventor: Joseph M. Hock
- Applicant: AVX Corporation
- Applicant Address: US SC Fountain Inn
- Assignee: KYOCERA AVX Components Corporation
- Current Assignee: KYOCERA AVX Components Corporation
- Current Assignee Address: US SC Fountain Inn
- Agency: Dority & Manning, P.A.
- Main IPC: H01G11/18
- IPC: H01G11/18 ; H01G11/10 ; H01G11/78 ; H01G11/34
Abstract:
A module comprises at least two ultracapacitors and at least one balancing circuit. The balancing circuit is connected to a heat dissipation component. The heat dissipation component is present on a heat sink comprising a metal.
Public/Granted literature
- US20190006124A1 Heat Dissipation From a Balancing Circuit For an Ultracapacitor Module Public/Granted day:2019-01-03
Information query
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