Invention Grant
- Patent Title: Methods and systems for cooling plasma treatment components
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Application No.: US17670670Application Date: 2022-02-14
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Publication No.: US12062523B2Publication Date: 2024-08-13
- Inventor: Cheng Kuang Tso , Chou-Feng Lee , Chih-Hsien Hsu , Chung-Hsiu Cheng , Jr-Sheng Chen
- Applicant: Taiwan Semiconductor Manufacturing Company
- Applicant Address: TW Hsinchu
- Assignee: Taiwan SemiConductor Manufacturing Company, LTD.
- Current Assignee: Taiwan SemiConductor Manufacturing Company, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Lippes Mathias LLP
- Main IPC: H01J37/32
- IPC: H01J37/32 ; H01L21/3065

Abstract:
Methods and systems for uniformly cooling a dome within a plasma treatment system are disclosed. The methods and systems utilize a diffuser including a perforated plate and a cone. The perforated plate includes a center portion and multiple arrays of holes with each array being located circumferentially at a different distance from the center. The cone extends away from the center. The diffuser spreads cooling gas more uniformly across the surface of the dome.
Public/Granted literature
- US20230260758A1 METHODS AND SYSTEMS FOR COOLING PLASMA TREATMENT COMPONENTS Public/Granted day:2023-08-17
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