Invention Grant
- Patent Title: Baffle unit and substrate processing apparatus
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Application No.: US17114722Application Date: 2020-12-08
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Publication No.: US12062527B2Publication Date: 2024-08-13
- Inventor: Jun Young Chung , Ryo Sasaki
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: IPUSA, PLLC
- Priority: JP 19229510 2019.12.19
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01J37/32

Abstract:
A baffle unit includes an inner ring, an outer ring disposed outside the inner ring, and a connecting portion connecting the inner ring with the outer ring. The connecting portion includes multiple openings arranged in a radial direction of the baffle unit and in a circumferential direction of the baffle unit, each of the multiple openings being arcuate and extending in the circumferential direction; multiple rigid portions each being disposed between the adjacent openings of the multiple openings that are adjacent to each other on a same concentric circle of the baffle unit; and multiple walls each being formed between the adjacent openings of the multiple openings that are adjacent to each other in the radial direction. Each of the multiple walls connects a rigid portion of the multiple rigid portions with another rigid portion of the multiple rigid portions.
Public/Granted literature
- US20210193443A1 BAFFLE UNIT AND SUBSTRATE PROCESSING APPARATUS Public/Granted day:2021-06-24
Information query
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