Invention Grant
- Patent Title: Amorphous carbon for gap fill
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Application No.: US17014039Application Date: 2020-09-08
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Publication No.: US12062536B2Publication Date: 2024-08-13
- Inventor: Xiaoquan Min , Kwangduk D. Lee
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/26 ; H10B41/27

Abstract:
Methods for depositing an amorphous carbon layer on a substrate and for filling a substrate feature with an amorphous carbon gap fill are described. The method comprises performing a deposition cycle comprising: introducing a hydrocarbon source into a processing chamber; introducing a plasma initiating gas into the processing chamber; generating a plasma in the processing chamber at a temperature of greater than 600° C.; forming an amorphous carbon layer on a substrate with a deposition rate of greater than 200 nm/hr; and purging the processing chamber.
Public/Granted literature
- US20220076945A1 AMORPHOUS CARBON FOR GAP FILL Public/Granted day:2022-03-10
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