A treatment method for an OOC action during a semiconductor production process includes: multiple Out Of Control Action Plan IDs (OCAPID) respectively corresponding to multiple semiconductor production process steps and multiple identified contents in one-to-one correspondence with the multiple OCAPIDs are established, and an OOC action checklist including multiple OOC action check items according to the identified contents is established; it is determined whether the OOC action occurs to a wafer subjected to the current semiconductor production process step, and if the OOC action occurs to the wafer, the current OCAPID corresponding to the current semiconductor production process step is automatically obtained, and the wafer is inspected according to the current identified content corresponding to the current OCAPID.