Invention Grant
- Patent Title: Air curtain for defect reduction
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Application No.: US17515785Application Date: 2021-11-01
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Publication No.: US12062562B2Publication Date: 2024-08-13
- Inventor: Wei-Chih Liao , Shih-Yu Tseng
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L21/677
- IPC: H01L21/677 ; B65G47/90 ; H01L21/687

Abstract:
Air curtain devices can reduce defects on semiconductor wafers when implemented on a track equipped with robotic wafer transport. The air curtain devices can be added to one or more processing devices arranged along the track to prevent defects from landing on wafer surfaces. For example, the air curtain devices can prevent volatile organic solvent mist from drifting towards processing devices on the track and preventing contamination via a wafer transport system.
Public/Granted literature
- US20220344190A1 AIR CURTAIN FOR DEFECT REDUCTION Public/Granted day:2022-10-27
Information query
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