Invention Grant
- Patent Title: Electronic device
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Application No.: US17287971Application Date: 2019-10-08
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Publication No.: US12062643B2Publication Date: 2024-08-13
- Inventor: Ivan-Christophe Robin , Zine Bouhamri , Philippe Gilet
- Applicant: Aledia
- Applicant Address: FR Echirolles
- Assignee: Aledia
- Current Assignee: Aledia
- Current Assignee Address: FR Echirolles
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: FR 71290 2018.10.24
- International Application: PCT/EP2019/077264 2019.10.08
- International Announcement: WO2020/083638A 2020.04.30
- Date entered country: 2021-04-22
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L25/075 ; H01L33/00 ; H01L33/62
Abstract:
A method for manufacturing an electronic device including the following steps: a) forming a wafer of electronic chips; b) fixing the wafer of electronic chips to a first support made of a stretchable material; c) removing and/or etching the wafer; and d) stretching the first support so as to move the chips away from one another.
Public/Granted literature
- US20210375834A1 ELECTRONIC DEVICE Public/Granted day:2021-12-02
Information query
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