Invention Grant
- Patent Title: Slicing micro-LED wafer and slicing micro-LED chip
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Application No.: US18346325Application Date: 2023-07-03
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Publication No.: US12062646B2Publication Date: 2024-08-13
- Inventor: Qunchao Xu , Qiming Li
- Applicant: JADE BIRD DISPLAY (SHANGHAI) LIMITED
- Applicant Address: CN Shanghai
- Assignee: JADE BIRD DISPLAY (SHANGHAI) LIMITED
- Current Assignee: JADE BIRD DISPLAY (SHANGHAI) LIMITED
- Current Assignee Address: CN Shanghai
- Agency: FINNEGAN, HENDERSON, FARABOW, GARRETT & DUNNER LLP
- Main IPC: H01L25/075
- IPC: H01L25/075 ; H01L27/12 ; H01L33/58 ; H01L33/62
Abstract:
A slicing micro-light emitting diode (LED) wafer includes a driver circuit substrate, a plurality of micro-LEDs formed on the driver circuit substrate, the plurality of micro-LEDs being made from a plurality of epitaxial layer slices arranged side-by-side on the driver circuit substrate, and a bonding layer, formed at bottoms of the plurality of epitaxial layer slices and on a top surface of the driver circuit substrate, for bonding the micro-LEDs and the driver circuit substrate.
Public/Granted literature
- US20230343763A1 SLICING MICRO-LED WAFER AND SLICING MICRO-LED CHIP Public/Granted day:2023-10-26
Information query
IPC分类:
