A package structure that includes a cavity between a solid-state imaging element and a cover member prevents damage caused due to an increase in the internal pressure in the cavity, for example, upon reflow. A solid-state imaging device includes a solid-state imaging element that includes a semiconductor substrate and of which a light-receiving side is a side of one of plate surfaces of the semiconductor substrate; a translucent cover member that is provided on the light-receiving side of the solid-state imaging element, and a support that is provided on the light-receiving side of the solid-state imaging element, and supports the cover member. The semiconductor substrate further includes a concave portion that is formed on another of the plate surfaces of the semiconductor substrate.