Invention Grant
- Patent Title: Semiconductor device including two-dimensional semiconductor material
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Application No.: US18055565Application Date: 2022-11-15
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Publication No.: US12062697B2Publication Date: 2024-08-13
- Inventor: Minhyun Lee , Minsu Seol , Yeonchoo Cho , Hyeonjin Shin
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: HARNESS, DICKEY & PIERCE, P.L.C.
- Priority: KR 20200007964 2020.01.21
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L21/02 ; H01L29/40 ; H01L29/417 ; H01L29/423 ; H01L29/66 ; H01L29/78

Abstract:
Provided is a semiconductor device which use a two-dimensional semiconductor material as a channel layer. The semiconductor device includes: a gate electrode on a substrate; a gate dielectric on the gate electrode; a channel layer on the gate dielectric; and a source electrode and a drain electrode that may be electrically connected to the channel layer. The gate dielectric has a shape with a height greater than a width, and the channel layer includes a two-dimensional semiconductor material.
Public/Granted literature
- US20230076900A1 SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL SEMICONDUCTOR MATERIAL Public/Granted day:2023-03-09
Information query
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