Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
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Application No.: US17272400Application Date: 2019-08-29
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Publication No.: US12062723B2Publication Date: 2024-08-13
- Inventor: Masahiro Takahashi , Naoki Okuno , Tomosato Kanagawa , Shota Mizukami
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: NIXON PEABODY LLP
- Agent Jeffrey L. Costellia
- Priority: JP 18167632 2018.09.07
- International Application: PCT/IB2019/057266 2019.08.29
- International Announcement: WO2020/049420A 2020.03.12
- Date entered country: 2021-03-01
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L29/24 ; H01L29/66

Abstract:
A highly reliable semiconductor device with favorable electrical characteristics is provided. The semiconductor device includes a first insulator; a first conductor and a second conductor over the first insulator; an oxide provided between the first conductor and the second conductor; a second insulator over the first conductor, the second conductor, and the oxide; and a third conductor over the second insulator. A side surface of the first conductor includes a region in contact with one side surface of the oxide, a side surface of the second conductor includes a region in contact with the other side surface of the oxide. The level of a top surface of the first conductor, the level of a top surface of the second conductor, and the level of a top surface of the oxide are substantially the same. The conductivity of the first conductor is higher than that of the oxide, and the conductivity of the second conductor is higher than that of the oxide.
Public/Granted literature
- US20210320209A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2021-10-14
Information query
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