An antenna coupled feed module is received in a slit formed between a metal frame and at least one electronic component of an electronic device. The antenna coupled feed module includes a substrate, at least one coupled feed portion, an active circuit, a metal layer, and a non-conductive layer. The coupled feed portion and the active circuit are disposed on opposite surfaces of the substrate; the coupled feed portion couples the electrical signals to the metal layer, the metal layer conducts the electrical signals to the metal frame to radiate wireless signals; the non-conductive layer is arranged between the metal layer and the at least one coupled feed portion, and covers the coupled feed portion; the active circuit switches the electrical signals fed to the coupled feed portion. An electronic device with the antenna coupled feed module is also provided.