Invention Grant
- Patent Title: Semiconductor device and method for manufacturing semiconductor device
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Application No.: US18203736Application Date: 2023-05-31
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Publication No.: US12063798B2Publication Date: 2024-08-13
- Inventor: Takanori Matsuzaki , Yoshinobu Asami , Daisuke Matsubayashi , Tatsuya Onuki
- Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
- Applicant Address: JP Atsugi
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi
- Agency: Fish & Richardson P.C.
- Priority: JP 17171238 2017.09.06
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/786 ; H10B99/00

Abstract:
A first transistor, a second transistor, a capacitor, and first to third conductors are included. The first transistor includes a first gate, a source, and a drain. The second transistor includes a second gate, a third gate over the second gate, first and second low-resistance regions, and an oxide sandwiched between the second gate and the third gate. The capacitor includes a first electrode, a second electrode, and an insulator sandwiched therebetween. The first low-resistance region overlaps with the first gate. The first conductor is electrically connected to the first gate and is connected to a bottom surface of the first low-resistance region. The capacitor overlaps with the first low-resistance region. The second conductor is electrically connected to the drain. The third conductor overlaps with the second conductor and is connected to the second conductor and a side surface of the second low-resistance region.
Public/Granted literature
- US20240008293A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2024-01-04
Information query
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