A device of application of a cold surface of a thermoelectric cooling (TEC) chip, the device includes a cooling part, a plate coil, a pump, a reservoir and a pipeline, the cooling part is used for connecting to the cold surface of TEC chip, the pump transfers antifreeze to circulate through the cooling part, the plate coil and the reservoir. Due the cooling part and the plate coil have large heat exchange area and excellent thermal conductivities, the device according to the present invention immediately conducts the cold temperature of the cold surface of TEC chip on operation of the TEC chip, the cooling efficiency thereof meets the standards of vehicle air conditioners and other products, so that the device according to the present invention has extremely high industrial availability.