Invention Grant
- Patent Title: Minimally invasive suturing device
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Application No.: US17743225Application Date: 2022-05-12
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Publication No.: US12070206B2Publication Date: 2024-08-27
- Inventor: Jude S. Sauer
- Applicant: LSI Solutions, Inc.
- Applicant Address: US NY Victor
- Assignee: LSI Solutions, Inc.
- Current Assignee: LSI Solutions, Inc.
- Current Assignee Address: US NY Victor
- Agent Michael E. Coyne
- Main IPC: A61B17/04
- IPC: A61B17/04 ; A61B17/062 ; A61B17/00
Abstract:
A minimally invasive suturing device is disclosed. The minimally invasive suturing device has a shaft and a distal tip. The minimally invasive suturing device also has a flexible span coupling the distal tip to the shaft. The flexible span has an angling link, a plurality of bending links, and an end link.
Public/Granted literature
- US20220346771A1 MINIMALLY INVASIVE SUTURING DEVICE Public/Granted day:2022-11-03
Information query
