Invention Grant
- Patent Title: Three-dimensional shaping device and method for manufacturing three-dimensional shaped object
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Application No.: US17583299Application Date: 2022-01-25
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Publication No.: US12070906B2Publication Date: 2024-08-27
- Inventor: Tatsuo Akasaka
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: SEIKO EPSON CORPORATION
- Current Assignee: SEIKO EPSON CORPORATION
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP 21009951 2021.01.26
- Main IPC: B29C64/35
- IPC: B29C64/35 ; B29C64/118 ; B29C64/209 ; B29C64/232 ; B29C64/236 ; B29C64/245 ; B33Y10/00 ; B33Y30/00 ; B33Y40/00

Abstract:
A three-dimensional shaping device includes an injection head having a nozzle, a stage, a motor, a brush, a blade, a memory, and a processor. The processor is configured to execute a program so as to cause the nozzle to reciprocally move along a zigzag path in a cleaning operation such that the nozzle passes from a side of the blade toward a side of the brush and from the side of the brush toward the side of the blade several times to contact at least one of the brush and the blade at different positions several times. The brush and the blade are disposed at a height at which the brush and the blade contact with the nozzle. The brush and the blade have a melting point higher than a plasticizing temperature of the plasticizing material and have hardness lower than hardness of the nozzle.
Public/Granted literature
- US12036740B2 Three-dimensional shaping device and method for manufacturing three-dimensional shaped object Public/Granted day:2024-07-16
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