The invention relates to a method of producing a plate arrangement comprising two plates (1, 2) which, at least in sections, have an intermediate space (4) located between them and a constant distance (d) to one another and/or are arranged parallel to one another and between which a fusible solder material (3, 3′) is arranged. The task of setting a defined distance between the plates as accurately as possible is solved according to the invention by creating a pressure difference between the intermediate space (4) between the plates and the outer space surrounding the plates in such a way that the pressure in the outer space is higher than in the intermediate space (4) and that the temperature of the solder material (3, 3′) is at least temporarily raised above its melting temperature during the existence of the pressure difference.