Invention Grant
- Patent Title: Photoresist developer and method of developing photoresist
-
Application No.: US18197640Application Date: 2023-05-15
-
Publication No.: US12074025B2Publication Date: 2024-08-27
- Inventor: Ming-Hui Weng , An-Ren Zi , Ching-Yu Chang , Chen-Yu Liu
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: STUDEBAKER & BRACKETT PC
- Main IPC: H01L21/027
- IPC: H01L21/027 ; G03F7/00 ; G03F7/11

Abstract:
A method of forming a pattern in a photoresist includes forming a photoresist layer over a substrate, and selectively exposing the photoresist layer to actinic radiation to form a latent pattern. The latent pattern is developed by applying a developer composition to the selectively exposed photoresist layer to form a pattern. The developer composition includes a first solvent having Hansen solubility parameters of 15 pKa>9.5; and a second solvent having a dielectric constant greater than 18. The first solvent and the second solvent are different solvents.
Public/Granted literature
- US20230282477A1 PHOTORESIST DEVELOPER AND METHOD OF DEVELOPING PHOTORESIST Public/Granted day:2023-09-07
Information query
IPC分类: