Invention Grant
- Patent Title: Wet bench structure
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Application No.: US16413275Application Date: 2019-05-15
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Publication No.: US12074041B2Publication Date: 2024-08-27
- Inventor: Chung-Yu Lin , Shih-Chi Kuo , Chun-Chieh Mo
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/02 ; H01L21/673 ; H01L21/687
Abstract:
The present disclosure describes an apparatus for processing one or more objects. The apparatus includes a carrier configured to hold the one or more objects, a tank filled with a processing agent and configured to receive the carrier, and a spinning portion configured to contact the one or more objects and to spin the one or more objects to disturb a flow field of the processing agent.
Public/Granted literature
- US20200006093A1 WET BENCH STRUCTURE Public/Granted day:2020-01-02
Information query
IPC分类:
