Invention Grant
- Patent Title: Wafer-like sensor
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Application No.: US16678278Application Date: 2019-11-08
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Publication No.: US12074044B2Publication Date: 2024-08-27
- Inventor: Felix J. Schuda , Mark C. LeClair
- Applicant: CyberOptics Corporation
- Applicant Address: US MN Golden Valley
- Assignee: CyberOptics Corporation
- Current Assignee: CyberOptics Corporation
- Current Assignee Address: US MN Golden Valley
- Agency: Kelly, Holt & Christenson, P.L.L.C.
- Agent Christopher R. Christenson
- Main IPC: B32B17/10
- IPC: B32B17/10 ; G05B19/418 ; H01L21/66 ; H01L21/67
Abstract:
A wafer-like semiconductor sensor includes a wafer-like base formed of a plurality of layers of chemically-hardened glass and an electronics module mounted to a recessed pocket in the base and containing a sensor.
Public/Granted literature
- US20200152494A1 WAFER-LIKE SENSOR Public/Granted day:2020-05-14
Information query
