Invention Grant
- Patent Title: Wafer processing apparatus and wafer processing method
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Application No.: US17407567Application Date: 2021-08-20
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Publication No.: US12074054B2Publication Date: 2024-08-27
- Inventor: Woon Kong , Ji Hoon Song , Ung Jo Moon , Ji Ho Park
- Applicant: ZEUS CO., LTD.
- Applicant Address: KR Hwaseong-si
- Assignee: ZEUS CO., LTD.
- Current Assignee: ZEUS CO., LTD.
- Current Assignee Address: KR Hwaseong-si
- Agency: KILE PARK REED & HOUTTEMAN PLLC
- Priority: KR 20200106760 2020.08.25
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/687
Abstract:
A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.
Public/Granted literature
- US20220068696A1 WAFER PROCESSING APPARATUS AND WAFER PROCESSING METHOD Public/Granted day:2022-03-03
Information query
IPC分类:
