Invention Grant
- Patent Title: Suspended semiconductor dies
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Application No.: US18052643Application Date: 2022-11-04
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Publication No.: US12074095B2Publication Date: 2024-08-27
- Inventor: Barry Jon Male , Marco Corsi
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Yudong Kim; Frank D. Cimino
- The original application number of the division: US17120941 2020.12.14
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L23/532
Abstract:
In examples, an electronic device comprises a printed circuit board (PCB), an orifice extending through the PCB, and a semiconductor die suspended above the orifice by aluminum bond wires. The semiconductor die is vertically aligned with the orifice and the bond wires coupled to the PCB.
Public/Granted literature
- US20230089201A1 SUSPENDED SEMICONDUCTOR DIES Public/Granted day:2023-03-23
Information query
IPC分类:
