Invention Grant
- Patent Title: Flat no-lead package with surface mounted structure
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Application No.: US17131222Application Date: 2020-12-22
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Publication No.: US12074100B2Publication Date: 2024-08-27
- Inventor: Rennier Rodriguez , Aiza Marie Agudon , Maiden Grace Maming
- Applicant: STMICROELECTRONICS, INC.
- Applicant Address: PH Calamba
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: PH Calamba
- Agency: Seed IP Law Group LLP
- The original application number of the division: US15808680 2017.11.09
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/64 ; H01L49/02
Abstract:
The present disclosure is directed to a flat no-lead semiconductor package with a surfaced mounted structure. An end portion of the surface mounted structure includes a recessed member so that the surface mounted structure is coupled to leads of the flat no-lead semiconductor package through, among others, the sidewalls of the recessed members.
Public/Granted literature
- US20210111109A1 FLAT NO-LEAD PACKAGE WITH SURFACE MOUNTED STRUCTURE Public/Granted day:2021-04-15
Information query
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