Invention Grant
- Patent Title: Semiconductor device
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Application No.: US18482301Application Date: 2023-10-06
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Publication No.: US12074108B2Publication Date: 2024-08-27
- Inventor: Takaco Umezawa
- Applicant: Kioxia Corporation
- Applicant Address: JP Tokyo
- Assignee: Kioxia Corporation
- Current Assignee: Kioxia Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kim & Stewart LLP
- Priority: JP 18172794 2018.09.14
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H01L23/522 ; H10B41/27 ; H10B41/35 ; H10B41/41 ; H10B43/27 ; H10B43/35 ; H10B43/40

Abstract:
A semiconductor device includes a first wiring extending in a first direction and a second wiring extending in a second direction crossing the first direction and having an end that faces the first wiring and is a predetermined distance away from the first wiring. The predetermined distance is approximately equal to a width of the second wiring, and the end of the second wiring is formed into one or more loops.
Public/Granted literature
- US20240038662A1 SEMICONDUCTOR DEVICE Public/Granted day:2024-02-01
Information query
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