Invention Grant
- Patent Title: Electric component with pad for a bump and manufacturing method thereof
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Application No.: US17620644Application Date: 2020-06-09
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Publication No.: US12074120B2Publication Date: 2024-08-27
- Inventor: Robert Felix Bywalez , Ute Steinhaeusser , Monika Schmiedgen
- Applicant: RF360 SINGAPORE PTE. LTD.
- Applicant Address: SG Republic Plaza
- Assignee: RF360 Singapore Pte. Ltd.
- Current Assignee: RF360 Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Polsinelli
- Priority: DE 2019117214.4 2019.06.26
- International Application: PCT/EP2020/065898 2020.06.09
- International Announcement: WO2020/260005A 2020.12.30
- Date entered country: 2021-12-17
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/00 ; H01L23/498
Abstract:
A bump pad enclosure providing an improved reliability of a bump connection is provided. The bump pad enclosure comprises an electrode pad, a UBM and a first shield. The first shield covers at least a first perimeter area of the electrode pad. The first shield is provided and configured to shield the first perimeter area from a detrimental influence of the environment.
Public/Granted literature
- US20220246546A1 ELECTRIC COMPONENT WITH PAD FOR A BUMP AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-08-04
Information query
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