Invention Grant
- Patent Title: Semiconductor device
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Application No.: US18339239Application Date: 2023-06-22
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Publication No.: US12074161B2Publication Date: 2024-08-27
- Inventor: Shinya Umeki
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: XSENSUS LLP
- Priority: JP 18103900 2018.05.30
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/06 ; H01L29/10 ; H01L29/739 ; H01L29/861

Abstract:
A semiconductor device includes a first-conductivity-type semiconductor layer that includes a first main surface on one side and a second main surface on the other side, an IGBT region that includes an FET structure and a second-conductivity-type collector region formed in a surface layer portion of the second main surface, the FET structure including a second-conductivity-type body region formed in a surface layer portion of the first main surface, a first-conductivity-type emitter region formed in a surface layer portion of the body region, and a gate electrode that faces both the body region and the emitter region across a gate insulating layer, a diode region that a includes second-conductivity-type first impurity region formed in the surface layer portion of the first main surface and a first-conductivity-type second impurity region formed in the surface layer portion of the second main surface.
Public/Granted literature
- US20230335548A1 SEMICONDUCTOR DEVICE Public/Granted day:2023-10-19
Information query
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