Invention Grant
- Patent Title: Structure for connecting lead wire
-
Application No.: US17442049Application Date: 2020-03-19
-
Publication No.: US12074391B2Publication Date: 2024-08-27
- Inventor: Takuya Yamane , Dai Yanase
- Applicant: SANYO Electric Co., Ltd.
- Applicant Address: JP Daito
- Assignee: PANASONIC ENERGY CO., LTD.
- Current Assignee: PANASONIC ENERGY CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: WHDA, LLP
- Priority: JP 19064717 2019.03.28
- International Application: PCT/JP2020/012310 2020.03.19
- International Announcement: WO2020/196268A 2020.10.01
- Date entered country: 2021-09-22
- Main IPC: H01R11/28
- IPC: H01R11/28 ; H01M50/213 ; H01M50/249 ; H01M50/298 ; H01M50/516 ; H01R4/02

Abstract:
A connection portion of a lead wire is close to a surface of a metal plate, held at an accurate position, and held while preventing the wire from being movable. A connection structure of the lead wire includes the metal plate, the lead wire connected to the surface of the metal plate, and a pair of holding protrusions. The holding protrusions sandwich at least two parts of the lead wire to dispose the lead wire at a fixed position. Each of the holding protrusions has a holding gap sandwiching and holding the press-fitted lead wire. A connection space of the lead wire and the metal plate is provided between the holding protrusions. The lead wire is held on the surface of the metal plate with the holding protrusions and is connected to the surface of the metal plate in the connection space.
Public/Granted literature
- US20220190495A1 STRUCTURE FOR CONNECTING LEAD WIRE Public/Granted day:2022-06-16
Information query